Chip package having tilted through silicon via

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9831155
APP PUB NO 20170263536A1
SERIAL NO

15068206

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A chip package includes at least one integrated circuit die. The integrated circuit die includes a substrate portion having an internal plane between a front side and a back side, an electrical interconnect portion on the front side, a plurality of first connection terminals on an upper surface of the electrical interconnect portion, a plurality of second connection terminals on the back side of the substrate portion, a plurality of connection wirings electrically connecting the first connection terminals and the second connection terminals, a chip selection terminal between the internal plane of the substrate portion and the upper surface of the electrical interconnect portion, and a chip selection wiring connected to the chip selection terminal and one of the second connection terminals and the first connection terminals. At least one of the chip selection wiring and the plurality of connection wirings includes a tilted portion with respect to the back side of the substrate portion.

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First Claim

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Patent Owner(s)

  • NANYA TECHNOLOGY CORPORATION

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Po Chun Changhua County, TW 21 52

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