Water resistant surface mount device package
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United States of America Patent
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Nov 28, 2017
Issued Date -
N/A
app pub date -
Jul 27, 2011
filing date -
Jul 30, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.
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