Resin composition, prepreg, metal foil-clad laminate and printed wiring board
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United States of America Patent
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Nov 28, 2017
Grant Date -
Jun 25, 2015
app pub date -
Jun 6, 2013
filing date -
Jun 12, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.
First Claim
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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