Microelectronic device package electromagnetic shield

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United States of America Patent

PATENT NO 9836095
SERIAL NO

15282481

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Microelectronic devices including an electromagnetic shield over a desired portion of a substrate. The magnetic shield is formed of conductive particles within a selectively curable layer, such as a solder resist material. After application to the substrate, the conductive particles are allowed to settle to form a conductive structure to serve as an electromagnetic shield. The electromagnetic shield can be formed primarily over regions of the substrate containing conductive traces coupled in the package to communicate signals presenting a risk of causing electromagnetic interference with other devices.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goh, Eng Huat Penang, MY 98 255
Koh, Boon Ping Seberang Jaya, MY 35 67
Lim, Min Suet Simpang Ampat, MY 119 430
Song, Wil Choon Bayan Lepas, MY 27 62
Yong, Khang Choong Puchong, MY 60 115

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