Tin-zinc microbump structures

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United States of America Patent

PATENT NO 9837341
SERIAL NO

15267040

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Abstract

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Techniques and mechanisms for providing effective connectivity with surface level microbumps on an integrated circuit package substrate. In an embodiment, different metals are variously electroplated to form a microbump which extends through a surface-level dielectric of a substrate to a seed layer including copper. The microbump includes a combination of tin and zinc that mitigates precipitation of residual copper by promoting the formation of miconstituents in the microbump. In another embodiment, the microbump has a mass fraction of zinc, or a mass fraction of tin, that is different in various regions along a height of the microbump.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chavali, Sri Chaitra J Chandler, US 15 49
Lee, Kyu Oh Chandler, US 56 227
Schuckman, Amanda E Scottsdale, US 23 112

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