Semiconductor die with a metal via

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United States of America Patent

PATENT NO 9837411
APP PUB NO 20170018503A1
SERIAL NO

14798535

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Abstract

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A semiconductor die that may include a substrate; an epitaxial layer; a metal layer; a first transistor; and a metal via that surrounds the first transistor, extends between the metal layer and the substrate, and penetrates the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOWER SEMICONDUCTOR LTDMIGDAL HAEMEK

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heiman, Alexey Ramat Ishay, IL 13 112
Levin, Sharon Haifa, IL 18 217
Levy, Sagy Zichron-Yaakov, IL 52 2118

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