Wired circuit board and producing method thereof
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United States of America Patent
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Dec 5, 2017
Grant Date -
Feb 12, 2015
app pub date -
Oct 27, 2014
filing date -
Sep 6, 2010
priority date (Note) -
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Abstract
A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.
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