Flowable compositions with low temperature curing to form thermally conductive pathways in electronics type applications and methods relating thereto

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United States of America Patent

PATENT NO 9840651
SERIAL NO

14791575

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Abstract

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A flowable, (e.g., screen printable, stencil printable and/or dispensable) thermally conductive paste is disclosed and provide low temperature curing or firing. The pastes are useful in forming thermally conductive pathways for electronic type applications, such as, providing thermal conduction between a semiconductor chip and its associate semiconductor chip packaging (e.g. power electronic applications), which can be useful in power converters, electrical power steering modules, car head lights (LEDs), solar cells, printed circuit boards (PCBs), plasma display panels (PDPs), and the like. The pastes have a combination of conductive flakes and particles in a minimal amount of carrier fluid and carrier resin to provide advantageous deposition and heat melding properties.

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Patent Owner(s)

Patent OwnerAddress
DU PONT CHINA LIMITEDBUILDING 304 EXPERIMENTAL STATION 200 POWDER MILL ROAD WILMINGTON DE 19803

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuge, Gareth Michael Bristol, GB 2 5
Hui, Dave Bristol, GB 9 31
Oleksyn, John McKean Bristol, GB 3 4
Parsons, Jason Kenneth Bristol, GB 3 4

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