Conductive pattern laminate and electronic device comprising same
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United States of America Patent
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Dec 12, 2017
Issued Date -
N/A
app pub date -
Mar 24, 2014
filing date -
Mar 22, 2013
priority date (Note) -
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Abstract
The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.
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