Heat spreading substrate with embedded interconnects

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United States of America Patent

PATENT NO 9842745
SERIAL NO

14600595

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Abstract

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Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beroz, Masud Apex, US 103 3166
Mohammed, Ilyas Santa Clara, US 305 7556

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