Substrate liquid processing apparatus

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United States of America Patent

PATENT NO 9842751
SERIAL NO

14922441

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Abstract

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Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kai, Yoshihiro Kumamoto, JP 57 1111
Kosai, Kazuki Kumamoto, JP 17 52
Tanaka, Mitsuo Kumamoto, JP 68 723
Umezaki, Shouta Kumamoto, JP 1 0

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