Lead and lead frame for power package
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United States of America Patent
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-
Dec 12, 2017
Issued Date -
N/A
app pub date -
Jul 1, 2014
filing date -
Mar 3, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both the main portion and the end portion. A bonding pad may also be included. The end portion may include a raised portion, bonded portion, and connecting portion. At least part of the bonded portion is bonded to the bonding pad and at least part of the raised portion is positioned over the bonding pad at a larger height than the bonded portion and connecting portion. The end portion may also include a plurality of similarly raised portions.
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