Curable adhesive compositions for flexible substrates

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United States of America Patent

PATENT NO 9845416
SERIAL NO

15524613

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Abstract

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A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.

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Patent Owner(s)

  • SAES GETTERS S.P.A.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gigli, Jiabril Legnano, IT 2 0
Mudu, Marco Rho, IT 3 0
Vacca, Paolo Milan, IT 23 28

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