Method of manufacturing multi-layer thin film, member including the same and electronic product including the same
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United States of America Patent
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Dec 19, 2017
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app pub date -
May 30, 2014
filing date -
May 31, 2013
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Abstract
Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.
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