Wafer alignment device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9846022
SERIAL NO

14865057

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Abstract

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An alignment device for a wafer in an industrial process assembly includes an inner surface shaped to conform to an outer surface of a wafer, an outer surface comprising at least two cams; and two ends connecting the inner surface to the outer surface. The two ends are positioned such that when the alignment device is positioned on the outer surface of the wafer, the alignment device extends more than one hundred eighty degrees around the wafer.

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Patent Owner(s)

Patent OwnerAddress
DIETERICH STANDARD INC5601 NORTH 71ST STREET BOULDER CO 80301

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bingham, Bryce Arthur Boulder, US 3 2
Kenyon, Nathaniel Kirk Boulder, US 7 22
Stehle, John Henry Boulder, US 7 25

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