Photomask including transfer patterns for reducing a thermal stress
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United States of America Patent
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Dec 19, 2017
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N/A
app pub date -
Nov 4, 2015
filing date -
Apr 2, 2015
priority date (Note) -
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Abstract
A photomask includes a light transmission substrate, and a transfer pattern disposed over the light transmission substrate, a shape of the transfer pattern being transferred onto a wafer by an exposure process. The transfer pattern comprises a first transfer pattern having a closed loop shape and having a first thickness, and a plurality of second transfer patterns disposed in an opening surrounded by the first transfer pattern, the plurality of second transfer patterns being arrayed in a first direction such that adjacent second transfer patterns are spaced apart from each other by a first distance, the second transfer patterns having a second thickness which is less than the first thickness of the first transfer pattern.
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