Method and apparatus for using universal cavity wafer in wafer level packaging
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United States of America Patent
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Dec 19, 2017
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app pub date -
Jun 9, 2016
filing date -
Jun 9, 2015
priority date (Note) -
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Abstract
An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.
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