Electronic module and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9847274
SERIAL NO

15375855

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Geitner, Ottmar Pentling, DE 10 239
Högerl, Jürgen Regensburg, DE 3 0
Nikitin, Ivan Regensburg, DE 75 455
Winter, Frank Regensburg, DE 36 1143

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