Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

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United States of America Patent

PATENT NO 9847314
SERIAL NO

15217389

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Importance

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Abstract

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A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

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Patent Owner(s)

  • KULICKE AND SOFFA INDUSTRIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schmidt-Lange, Michael P North Wales, US 15 80
Wasserman, Matthew B Philadelphia, US 22 85

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