Semiconductor packages including through mold ball connectors and methods of manufacturing the same
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United States of America Patent
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Dec 19, 2017
Grant Date -
Nov 23, 2017
app pub date -
Jan 6, 2017
filing date -
May 18, 2016
priority date (Note) -
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Abstract
There is provided a structure and a method of manufacturing a semiconductor package. The method includes disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, recessing a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, and mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.
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