Heat dissipation for substrate assemblies
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United States of America Patent
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Dec 19, 2017
Issued Date -
N/A
app pub date -
Nov 2, 2016
filing date -
Feb 27, 2014
priority date (Note) -
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Abstract
Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.
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