Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same

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United States of America Patent

PATENT NO 9850390
SERIAL NO

15188454

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An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:

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Patent Owner(s)

  • SAMSUNG SDI CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheon, Jin Min Suwon-si, KR 13 63
Choi, Jin Woo Suwon-si, KR 163 685
Chung, Joo Young Suwon-si, KR 17 16
Han, Seung Suwon-si, KR 23 23
Kim, Min Gyum Suwon-si, KR 11 12
Kwon, Ki Hyeok Suwon-si, KR 6 8

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