Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips
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United States of America Patent
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Dec 26, 2017
Grant Date -
Feb 16, 2017
app pub date -
Oct 31, 2016
filing date -
Mar 25, 2015
priority date (Note) -
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Abstract
An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.
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