PREVENTION OF REVERSE ENGINEERING OF SECURITY CHIPS
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United States of America Patent
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Dec 26, 2017
Grant Date -
Dec 28, 2017
app pub date -
Jun 28, 2016
filing date -
Jun 28, 2016
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Abstract
A semiconductor chip includes a chip substrate; a self-destructive layer arranged on the chip substrate, the self-destructive layer including a pyrophoric reactant; and a sealant layer arranged on a surface of the self-destructive layer, on sidewalls of the self-destructive layer, and on the chip substrate such that the sealant layer forms a package seal on the semiconductor chip; wherein the pyrophoric reactant ignites spontaneously upon exposure to air.
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