Systems and methods for high-speed, low-profile memory packages and pinout designs

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United States of America Patent

PATENT NO 9853016
SERIAL NO

15435719

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Abstract

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Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

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Patent Owner(s)

  • APPLE INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boyle, Evan R Cupertino, US 6 51
Fai, Anthony Palo Alto, US 33 1024
Wu, Zhonghua Cupertino, US 26 116
Yang, Zhiping Cupertino, US 26 260

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