Laminate sub-mounts for LED surface mount package

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United States of America Patent

PATENT NO 9853199
SERIAL NO

15042927

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Abstract

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An LED package is described that acts as a sub-mount between a printed circuit board and a diode. The sub-mount includes a laminate to thermally isolate the diode, for example an LED, from the PCB while providing a thermal heat dissipative sink for the diode.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kolbe, Justin Rochester, US 2 0
Taylor, Steve Prescott, US 23 458

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