Sealed packaging for microelectromechanical systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9856132
SERIAL NO

13821589

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
FAIRCHILD SEMICONDUCTOR CORPORATION5005 E MCDOWELL ROAD MAILDROP A700 PHOENIX AS 85008

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Acar, Cenk Newport Coast, US 45 1724
Bloomsburgh, John Gardner Oakland, US 8 317
Bryzek, Janusz Oakland, US 39 1130

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Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jul 2, 2021
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 2, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 2, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00