Sealed packaging for microelectromechanical systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9856132
SERIAL NO

13821589

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.

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Patent Owner(s)

  • FAIRCHILD SEMICONDUCTOR CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Acar, Cenk Newport Coast, US 48 2040
Bloomsburgh, John Gardner Oakland, US 8 372
Bryzek, Janusz Oakland, US 57 1397

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