Polishing composition and method for polishing magnetic disk substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9856401
SERIAL NO

15278911

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
YAMAGUCHI SEIKEN KOGYO CO LTD1631 SHIMIZUYAMA 2-CHOME MIDORI-KU NAGOYA-SHI AICHI 4598009

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwata, Toru Aichi, JP 116 1702
Sugawa, Akira Aichi, JP 5 10

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 2, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 2, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00