Methods of controlling distortion of exposure processes

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United States of America Patent

PATENT NO 9857678
SERIAL NO

15408834

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Abstract

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A method of controlling distortion of an exposure process is provided. The method includes aligning an exposure mask with a wafer, forming a first test pattern on the wafer by performing a first exposure with the exposure mask and a first illumination system, forming a photoresist layer on an entire surface of the wafer including the first test pattern, performing a second exposure with the exposure mask and a second illumination system to form a second test pattern overlapping with the first test pattern, extracting a distortion value between the first test pattern and the second test pattern, and correcting the exposure mask or fabricating a corrected exposure mask using the distortion value.

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Patent Owner(s)

  • SK HYNIX INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Shin Young Seoul, KR 11 25
Park, Chan Ha Gyeonggi-do, KR 17 47

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