Method of manufacturing substrate and substrate and mask film

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United States of America Patent

PATENT NO 9857687
SERIAL NO

14770979

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Abstract

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A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

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Patent Owner(s)

Patent OwnerAddress
YAMATOYA & CO LTD5-9-7 TORENOMON MINATO-KU TOKYO
TOKAI SHINEI ELECTRONICS INDUSTRY CO LTDGIFU COUNTY JAPAN
SAITO TADAYOSHI2-44-1 KOYAMADAI SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-0002

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Koji Ena, JP 99 1259
Inoue, Akira Tokyo, JP 419 4465
Kato, Takehiro Ena, JP 14 57
Murakami, Masaru Ena, JP 37 615
Nishio, Kazuyoshi Ena, JP 1 0
Numakura, Iwao Tokyo, JP 17 173
Saito, Tadayoshi Yokohama, JP 15 854
Tanaka, Kiyoshi Ena, JP 86 1134
Tanaka, Yoshihito Ena, JP 13 103
Tsuge, Kazunori Ena, JP 46 843
Tsukada, Noriaki Tokyo, JP 7 123
Yoshimura, Hirotoshi Tokyo, JP 1 0

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