Apparatus and a method of machining a shape through a component
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United States of America Patent
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Jan 2, 2018
Issued Date -
N/A
app pub date -
Jan 15, 2016
filing date -
Feb 13, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of laser drilling a hole comprising providing a laser source at a first side of a component to laser drill a hole through the component. A light source is positioned in the path of the laser beam at the opposite side of the component. A camera is provided at the first side of the component. The camera is positioned such that it has a line of sight view of the light source through the laser drilled hole. The laser drilled hole in the component is viewed using the light provided by the light source at the opposite side of the component. The parameters of the laser drilled hole are measured using the view of the laser drilled hole provided by the camera and a flow of gas is provided over the surface of the light source to protect the light source.
First Claim
Family
International Classification(s)
- H04N:PICTORIAL COMMUNICATION, e.g. TELEVISION
- G06T:IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- B64F:GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS
- B23H:WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRA....
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