Tamper resistant electronic devices
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United States of America Patent
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Jan 2, 2018
Issued Date -
N/A
app pub date -
Oct 20, 2016
filing date -
Oct 20, 2016
priority date (Note) -
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Abstract
A tamper resistant device comprises a matrix material and a microcapsule in the matrix material. The microcapsule has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus, such as temperature increases or compressive forces. The first compartment contains a first component, and the second compartment contains a second component. The first and second components react exothermically (produce heat) when in contact with each other. Thus, in some examples, a temperature change in the device resulting from the rupture of the isolating structure in the microcapsule due to physical tampering efforts can be used to trigger a security response.
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