Substrate rinsing systems and methods

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United States of America Patent

PATENT NO 9859135
SERIAL NO

14626903

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Importance

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Abstract

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An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Brian J Palo Alto, US 204 5717
Francischetti, Vincent S Columbia Falls, US 2 6
Frankel, Jonathan S Los Gatos, US 8 33
Hanson, Kyle M Kalispell, US 157 2514
McHugh, Paul Kalispell, US 13 40
Mikhaylichenko, Ekaterina San Jose, US 16 25

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