Integrated circuit package fabrication

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9859197
SERIAL NO

14691660

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of making an integrated circuit (“IC”) device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TEXAS INSTRUMENTS INCORPORATED

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eugene, Lee Lee Han Meng@ Johor, MY 15 43
Fen, Sueann Lim Wei Melaka, MY 13 60
Ismail, Sarel Bin Duyong, MY 3 26

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 2, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 2, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00