Package structure and method for forming the same

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United States of America Patent

PATENT NO 9859229
SERIAL NO

15227060

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Abstract

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Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a first shielding feature over a base layer. The package structure also includes a package layer encapsulating the integrated circuit die and the first shielding feature. The package structure further includes a second shielding feature extending from the side surface of the base layer towards the first shielding feature to electrically connect to the first shielding feature. The side surface of the second shielding feature faces away from the side surface of the base layer and is substantially coplanar with the side surface of the package layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, Pingtung County, TW 100 1568
Cheng, Ming-Da Zhubei, TW 447 4774
Chiu, Sheng-Hsiang Tainan, TW 29 137
Hsieh, Ching-Hua Hsinchu, TW 265 2259
Lin, Chih-Wei Zhubei, TW 359 5145
Lin, Wei-Hung Xinfeng Township, Hsinchu County, TW 175 1616
Liu, Chung-Shi Hsinchu, TW 824 11367
Tsai, Yu-Peng Taipei, TW 43 1203
Weng, Sheng-Feng Taichung, TW 31 75

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