Chip structure

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United States of America Patent

PATENT NO 9862600
SERIAL NO

14718152

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Abstract

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One example discloses an chip, comprising: a substrate; a first side of a passivation layer coupled to the substrate; a device, having a device height and a cavity, wherein a first device surface is coupled to a second side of the passivation layer which is opposite to the first side of the passivation layer; and a set of structures coupled to the second side of the passivation layer and configured to have a structure height greater than or equal to the device height.

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Patent Owner(s)

  • AMS INTERNATIONAL AG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bouman, Hendrik Nijmegen, NL 7 13
Daamen, Roel Eindhoven, NL 46 369
Vijayakumar, Kailash Chennai, IN 5 3

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