Polishing composition and method for polishing magnetic disk substrate

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United States of America Patent

PATENT NO 9862863
SERIAL NO

15278351

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Abstract

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Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 μm, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

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Patent Owner(s)

Patent OwnerAddress
YAMAGUCHI SEIKEN KOGYO CO LTD1631 SHIMIZUYAMA 2-CHOME MIDORI-KU NAGOYA-SHI AICHI 4598009

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwata, Toru Aichi, JP 116 1702
Sugawa, Akira Aichi, JP 5 10

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