Feedthrough assemblies

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United States of America Patent

PATENT NO 9865533
SERIAL NO

14966101

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Abstract

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Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

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Patent Owner(s)

  • MEDTRONIC, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ruben, David A Mesa, US 79 1787
Sandlin, Michael S Chandler, US 14 171

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