Methods to control wafer warpage upon compression molding thereof and articles useful therefor

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United States of America Patent

PATENT NO 9865551
SERIAL NO

14953787

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Importance

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Abstract

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Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

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Patent Owner(s)

  • HENKEL IP & HOLDING GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoang, Gina Garden Grove, US 10 109
Takano, Tadashi Irvine, US 60 566

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