Warpage control with intermediate material
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United States of America Patent
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Jan 9, 2018
Issued Date -
N/A
app pub date -
Aug 4, 2015
filing date -
Aug 5, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.
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