Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
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United States of America Patent
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Jan 16, 2018
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app pub date -
Jan 29, 2015
filing date -
Jan 29, 2014
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Abstract
An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.
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