Composition for etching

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United States of America Patent

PATENT NO 9868902
SERIAL NO

14797050

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Abstract

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The disclosure is related to a composition for etching, a method for manufacturing the composition, and a method for fabricating a semiconductor using the same. The composition may include a first inorganic acid, at least one of silane inorganic acid salts produced by reaction between a second inorganic acid and a silane compound, and a solvent. The second inorganic acid may be at least one selected from the group consisting of a sulfuric acid, a fuming sulfuric acid, a nitric acid, a phosphoric acid, and a combination thereof.

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Patent Owner(s)

Patent OwnerAddress
SOULBRAIN CO LTDSEONGNAM-SI GYEONGGI-DO 13486

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jin Uk Daejeon, KR 94 398
Lim, Jung Hun Daejeon, KR 36 109
Park, Jae Wan Daegu, KR 69 487

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