Heat sink for light emitting diode
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Aug 30, 2013
filing date -
Nov 8, 2012
priority date (Note) -
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Abstract
A heat sink includes a base, to which an LED element is attached, and a plate-shaped heat dissipating surface integrally and continuously formed with the base around the LED element. The base and the plate-shaped heat dissipating surface are formed of aluminum or an aluminum alloy having a specific thermal conductivity λ and a specific surface emissivity ε. When the plate thickness of the base and the plate-shaped heat dissipating surface is specified in a range from 0.8 to 6 mm, a total projected area of the heat dissipating surfaces of the heat sink is specified in a range from 19000 to 60000 mm2 so as to obtain a heat resistance of 4.0 K/W or smaller. Projected areas of two plate-shaped heat dissipating surfaces of the heat sink in two different directions are sufficiently increased with respect to corresponding sectional areas of the base.
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