Transponder wire bonded to round wire on adhesive tape having a water-soluble backing
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Jan 26, 2017
filing date -
Jan 26, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).
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