Semiconductor package with clip alignment notch
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United States of America Patent
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Jan 16, 2018
Grant Date -
Jan 11, 2018
app pub date -
Jul 11, 2016
filing date -
Jul 11, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. The top notch includes a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch, and can also include a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base. The first semiconductor die can include a die top side a die bottom side opposite the die top side and mounted onto the leadframe top side, and a die perimeter. The top notch can be located outside the die perimeter. Other examples and related methods are also disclosed.
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