Laminates of integrated electromagnetically shieldable thin inductors, capacitors, and semiconductor chips
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United States of America Patent
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Jan 16, 2018
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N/A
app pub date -
Dec 2, 2015
filing date -
Dec 10, 2014
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Abstract
Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.
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