Optical module blind mating heat relay system
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Dec 31, 2015
filing date -
Dec 31, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An optical module blind mating heat relay system, comprising a linecard comprising a circuit board; a heat relay apparatus comprising a first heat pipe on the circuit board, a radiator attached to the circuit board and in thermal contact with the first heat pipe; a heat relay receiver assembly comprising a receiver housing having a slot and a contact slug connected to the receiver housing and in thermal contact with the first heat pipe; a pluggable optical module removably engaged with the linecard; and a second heat pipe having a pluggable optical module portion contacting the pluggable optical module and having a plug portion removably positioned within the slot of the receiver housing, the plug portion in thermal contact with the contact slug, the second heat pipe removable from the receiver housing while the linecard is receiving electrical power.
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