Radiation-sensitive resin composition and resist pattern-forming method

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United States of America Patent

PATENT NO 9874816
SERIAL NO

15079753

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Abstract

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A radiation-sensitive resin composition comprises: a polymer, and a radiation-sensitive acid generator. The polymer comprises a structural unit comprising: an acid-labile group; and an oxoacid group or phenolic hydroxyl group protected by the acid-labile group. The acid-labile group is represented by formula (1). R1 and R2 each independently represent a divalent organic group having 1 to 20 carbon atoms. R3 represents a monovalent group having 1 to 40 atoms and having at least one selected from the group consisting of an oxygen atom, a sulfur atom and a nitrogen atom. * denotes a binding site to the oxy group in the oxoacid group or phenolic hydroxyl group protected.

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Patent Owner(s)

  • JSR CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Namai, Hayato Tokyo, JP 28 104

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