Semiconductor bonding apparatus and related techniques

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9875917
APP PUB NO 20170243769A1
SERIAL NO

15440211

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.

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Patent Owner(s)

Patent OwnerAddress
SUSS MICROTEC LITHOGRAPHY GMBHSCHLEISSHEIMER STRASSE 90 GARCHING 85748

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
George, Gregory Colchester, US 42 589
Johnson, Hale Jericho, US 19 200

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